年度111
等級其他
論文名稱Expectation-maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor
全部作者Tzu-Chia Chen
卷數Journal of Physics-Condensed Matter 35, 305901
ISSN(ISBN)1361-648X; 0953-8984
使用語言英文
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