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年度論文名稱
2023Tzu-Chia Chen; Hani Almimi; Mohammad Sh. Daoud; John William Grimaldo Guerrero; Rafał Chorzępa, Selection of effective combination of time and frequency features using PSO-based technique for monitoring oil pipelines, , Alexandria Engineering Journal 82, p.518-530, , pp
2023L.W. Lee; Y.H. Yang; I.H. Li, A Design of Pneumatic-Driven Translational Pyramidal Manipulator and Its Actively Disturbance Rejection Tracking Control, , Mechatronics 98, 103122, , pp
2022S.T. Wang; I.H. Li; W.Y. Wang, Implementation of Handwritten Character Recognition and Writing in Pyramidal Manipulator Using CNN, , International Journal of iRobotics 6(1), p. 12-16, , pp
2022Yuanping Kan; C. Y. Chang; Shih-Jung Wu; Chin-Hwa Kuo; Diptendu Sinha Roy, CSCP: Energy Charging Mechanism for Surveillance Quality, Network Connectivity and Perpetual Lifetime in WRSNs, , Journal of Internet Technology 24(2), p. 461-473, , pp
2022Kuo H-C; Chen S-H; Chen Y-H; Lin Y-C; C. Y. Chang; Wu Y-C; Wang T-D; Chang L-S; Tai I-H; Hsieh K-S, Detection of coronary lesions in Kawasaki disease by Scaled-YOLOv4 with HarDNet backbone, , Frontiers in Cardiovascular Medicine 22(9), p. 1-8, , pp
2022Tzu-Chia Chen; Ngakan Ketut Acwin Dwijendra; I. Wayan Parwata; Agata Iwan Candra; Elsayed M. Tag El Din, Multi-Objective Optimization of External Louvers in Buildings, , Computers, Materials & Continua 75(1), p.1305-1316, , pp
2022Chen, Tzu-Chia; Dwijendra N.K.A.; Singhal, Saurabh; Sivaraman R.; Mamdouh, Amr, Intelligent System Application to Monitor the Smart City Building Lighting, , Computers, Materials and Continua 75(2), p.3159-3169, , pp
2022Tzu-Chia Chen; Abdullah M. Iliyasu; Seyed Mehdi Alizadeh; Ahmed S. Salama; Ehsan Eftekhari-Zadeh; Kaoru Hirota, The use of artificial intelligence and time characteristics in the optimization of the structure of the volumetric percentage detection system independent of the scale value inside the pipe, , Applied Artificial Intelligence 37(1), 2166225, , pp
2022Tzu-Chia Chen, Microstructural characterization of Ti/Cu/Ti diffusion bonded system through a micromechanical data-driven neural network approach, , Materials Today Communications 35, 105858, , pp
2022Tzu-Chia Chen, Expectation-maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor, , Journal of Physics-Condensed Matter 35, 305901, , pp